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Keywords: Time-Frequency AnalysisClose
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 179-197, July 8–12, 2007
Paper No: IPACK2007-33872
... and solder ball failure. This allows the physical quantification of solder ball crack damage in the form of confidence values and provides a damage index that can be utilized for the health monitoring of solder interconnects in an electronic assembly. Time-Frequency Analysis Ball-Grid Arrays Feature...