1-20 of 21
Thermal resistance
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Mass Nature of Heat and Its Application VII: Coupled Heat and Mass Transfer Optimization Based on the Entransy Theory

Qun Chen, Moran Wang, Ning Pan, Zeng-Yuan Guo
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 8, 141-150, August 8–13, 2010
Paper No: IHTC14-22413
DOI: https://doi.org/10.1115/IHTC14-22413
View Paper titled, Mass Nature of Heat and Its Application VII: Coupled Heat and Mass Transfer Optimization Based on the Entransy Theory
Click here to open pdf in another window PDF for Mass Nature of Heat and Its Application VII: Coupled Heat and Mass Transfer Optimization Based on the Entransy Theory
Topics: Heat, Mass transfer, Optimization, Energy dissipation, Evaporative cooling, Thermal resistance, Latent heat, Temperature
Proceedings Papers

Mass Nature of Heat and Its Applications V: Entransy, Entransy Dissipation and Heat Transfer Irreversibility

Xin-Gang Liang, Qun Chen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 847-856, August 8–13, 2010
Paper No: IHTC14-22422
DOI: https://doi.org/10.1115/IHTC14-22422
View Paper titled, Mass Nature of Heat and Its Applications V: Entransy, Entransy Dissipation and Heat Transfer Irreversibility
Click here to open pdf in another window PDF for Mass Nature of Heat and Its Applications V: Entransy, Entransy Dissipation and Heat Transfer Irreversibility
Topics: Energy dissipation, Heat, Heat transfer, Optimization, Boundary-value problems, Thermal resistance, Convection, Entropy, Heat conduction, Heat flux
Proceedings Papers

Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources

Mitsuo Hashimoto, Hiroto Kasai, Kazuma Usami, Hiroyuki Ryoson, Kazuaki Yazawa, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 523-533, August 8–13, 2010
Paper No: IHTC14-22765
DOI: https://doi.org/10.1115/IHTC14-22765
View Paper titled, Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources
Click here to open pdf in another window PDF for Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources
Topics: Cooling, Flat heat pipes, Heat flux, Heat, Copper powders, Particulate matter, Stress, Vapors, Aluminum, Carbon nanotubes
Proceedings Papers

High-Flux Thin Film Evaporation on Nanostructured Surfaces

Rong Xiao, Kuang-Han Chu, Evelyn N. Wang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 853-860, August 8–13, 2010
Paper No: IHTC14-22905
DOI: https://doi.org/10.1115/IHTC14-22905
View Paper titled, High-Flux Thin Film Evaporation on Nanostructured Surfaces
Click here to open pdf in another window PDF for High-Flux Thin Film Evaporation on Nanostructured Surfaces
Topics: Evaporation, Thin films, Heat, Liquid films, Energy dissipation, Columns (Structural), Design, Electronic systems, Electronics, Flow (Dynamics)
Proceedings Papers

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

Takashi Fukue, Masaru Ishizuka, Shinji Nakagawa, Tomoyuki Hatakeyama, Wataru Nakayama
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 657-664, August 8–13, 2010
Paper No: IHTC14-22979
DOI: https://doi.org/10.1115/IHTC14-22979
View Paper titled, Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink
Click here to open pdf in another window PDF for Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink
Topics: Air flow, Electronic equipment, Heat sinks, Heat transfer, Network analysis, Electrical components, Design, Computational fluid dynamics, Design methodology, Flow (Dynamics)
Proceedings Papers

Theoretical Investigation on Effective Thermal Conductivity of a Disk-Shaped Composite System

Yasushi Koito, Toshio Tomimura, Shuichi Torii
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 585-592, August 8–13, 2010
Paper No: IHTC14-22870
DOI: https://doi.org/10.1115/IHTC14-22870
View Paper titled, Theoretical Investigation on Effective Thermal Conductivity of a Disk-Shaped Composite System
Click here to open pdf in another window PDF for Theoretical Investigation on Effective Thermal Conductivity of a Disk-Shaped Composite System
Topics: Composite materials, Disks, Thermal conductivity, Electrical wires, Metals, Thermal resistance, Computer simulation, Heat transfer
Proceedings Papers

Compact Heat Sink With Combined Structures of Dimples-Protrusions With Pin-Fins or Micro-Channels: Review, Simulation and Experimental Data

Mikhail Spokoyny, Vladimir Trofimov, Xinliang Qiu, James M. Kerner
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 481-493, August 8–13, 2010
Paper No: IHTC14-22347
DOI: https://doi.org/10.1115/IHTC14-22347
View Paper titled, Compact Heat Sink With Combined Structures of Dimples-Protrusions With Pin-Fins or Micro-Channels: Review, Simulation and Experimental Data
Click here to open pdf in another window PDF for Compact Heat Sink With Combined Structures of Dimples-Protrusions With Pin-Fins or Micro-Channels: Review, Simulation and Experimental Data
Topics: Fins, Heat sinks, Microchannels, Simulation, Heat transfer, Reynolds number, Vortices, Computer simulation, Design, Experimental analysis
Proceedings Papers

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Mark Eblen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 603-610, August 8–13, 2010
Paper No: IHTC14-22891
DOI: https://doi.org/10.1115/IHTC14-22891
View Paper titled, Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages
Click here to open pdf in another window PDF for Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages
Topics: Ceramics, Copper, Thermal conductivity, Design, Finite element analysis, Flip-chip, Flip-chip devices, Heat, Heat conduction, Integrated circuits
Proceedings Papers

Experimental Study on a Flat Loop Heat Pipe Coupling the Compensation Chamber and the Condenser

Dong-chuan Mo, Guan-sheng Zou, Shu-shen Lu
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 349-354, August 8–13, 2010
Paper No: IHTC14-22405
DOI: https://doi.org/10.1115/IHTC14-22405
View Paper titled, Experimental Study on a Flat Loop Heat Pipe Coupling the Compensation Chamber and the Condenser
Click here to open pdf in another window PDF for Experimental Study on a Flat Loop Heat Pipe Coupling the Compensation Chamber and the Condenser
Topics: Condensers (steam plant), Heat pipes, Oscillations, Temperature, Heat, Heat transfer, Cylinders, Design, Leakage, Stress
Proceedings Papers

An Experimental Study of Two Phase Multiple Jet Cooling on Straight-Finned Surfaces Using a Dielectric Fluid

Liang-Han Chien, Chin-Yao Chang, Han-Yang Liu
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 629-638, August 8–13, 2010
Paper No: IHTC14-22720
DOI: https://doi.org/10.1115/IHTC14-22720
View Paper titled, An Experimental Study of Two Phase Multiple Jet Cooling on Straight-Finned Surfaces Using a Dielectric Fluid
Click here to open pdf in another window PDF for An Experimental Study of Two Phase Multiple Jet Cooling on Straight-Finned Surfaces Using a Dielectric Fluid
Topics: Cooling, Fluids, Flow (Dynamics), Jets, Computer cooling, Cooling systems, Electronics, Heat, Heat transfer, Nozzles
Proceedings Papers

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, Hongbin Ma
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 385-391, August 8–13, 2010
Paper No: IHTC14-22706
DOI: https://doi.org/10.1115/IHTC14-22706
View Paper titled, An Investigation of Flat-Plate Oscillating Heat Pipes
Click here to open pdf in another window PDF for An Investigation of Flat-Plate Oscillating Heat Pipes
Topics: Flat plates, Heat pipes, Water, Fluids, Heat transfer, Thermal resistance, Diamonds, Nanofluids, Operating temperature, Copper
Proceedings Papers

Operational Mechanism of Square Capillary Looped Pulsating Heat Pipe

Wei Qu, Bin Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 337-342, August 8–13, 2010
Paper No: IHTC14-22331
DOI: https://doi.org/10.1115/IHTC14-22331
View Paper titled, Operational Mechanism of Square Capillary Looped Pulsating Heat Pipe
Click here to open pdf in another window PDF for Operational Mechanism of Square Capillary Looped Pulsating Heat Pipe
Topics: Flow (Dynamics), Heat pipes, Thermal resistance, Fluids, Heat transfer
Proceedings Papers

Thermal Performance of Carbon Nanotube Enhanced Vapor Chamber Wicks

Sungwon S. Kim, Justin A. Weibel, Timothy S. Fisher, Suresh V. Garimella
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 417-424, August 8–13, 2010
Paper No: IHTC14-22929
DOI: https://doi.org/10.1115/IHTC14-22929
View Paper titled, Thermal Performance of Carbon Nanotube Enhanced Vapor Chamber Wicks
Click here to open pdf in another window PDF for Thermal Performance of Carbon Nanotube Enhanced Vapor Chamber Wicks
Topics: Carbon nanotubes, Vapors, Copper, Heat, Flux (Metallurgy), Boiling, Capillarity, Fluids, Thermal resistance, Coatings
Proceedings Papers

Evaluation of a Coaxial Borehole Heat Exchanger Prototype

Jose´ Acun˜a, Palne Mogensen, Bjo¨rn Palm
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 343-350, August 8–13, 2010
Paper No: IHTC14-22374
DOI: https://doi.org/10.1115/IHTC14-22374
View Paper titled, Evaluation of a Coaxial Borehole Heat Exchanger Prototype
Click here to open pdf in another window PDF for Evaluation of a Coaxial Borehole Heat Exchanger Prototype
Topics: Engineering prototypes, Heat exchangers, Flow (Dynamics), Design, Pipes, Computer software, Finite element methods, Finite element model, Geometry, Heat
Proceedings Papers

Dropwise Condensation Life Testing of Self Assembled Monolayers

Richard W. Bonner, III
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 221-226, August 8–13, 2010
Paper No: IHTC14-22936
DOI: https://doi.org/10.1115/IHTC14-22936
View Paper titled, Dropwise Condensation Life Testing of Self Assembled Monolayers
Click here to open pdf in another window PDF for Dropwise Condensation Life Testing of Self Assembled Monolayers
Topics: Condensation, Life testing, Self-assembly, Coatings, Electronics, Heat pipes, Computer cooling, Copper, Electronic packages, Flux (Metallurgy)
Proceedings Papers

Measurement of Heat Transfer and Pressure Drop During Condensation of Carbon Dioxide in Microscale Geometries

Brian M. Fronk, Srinivas Garimella
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 235-243, August 8–13, 2010
Paper No: IHTC14-22987
DOI: https://doi.org/10.1115/IHTC14-22987
View Paper titled, Measurement of Heat Transfer and Pressure Drop During Condensation of Carbon Dioxide in Microscale Geometries
Click here to open pdf in another window PDF for Measurement of Heat Transfer and Pressure Drop During Condensation of Carbon Dioxide in Microscale Geometries
Topics: Carbon dioxide, Condensation, Heat transfer, Microscale devices, Pressure drop, Heat transfer coefficients, Copper, Temperature, Diffusion bonding (Metals), Electroforming
Proceedings Papers

Numerical Study of Air Forced Convection in a Rectangular Channel Provided With Ribs

O. Manca, S. Nardini, D. Ricci
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 861-870, August 8–13, 2010
Paper No: IHTC14-23244
DOI: https://doi.org/10.1115/IHTC14-23244
View Paper titled, Numerical Study of Air Forced Convection in a Rectangular Channel Provided With Ribs
Click here to open pdf in another window PDF for Numerical Study of Air Forced Convection in a Rectangular Channel Provided With Ribs
Topics: Forced convection, Heat transfer, Turbulence, Flow (Dynamics), Fluid dynamics, Convection, Engineering simulation, Flow separation, Fluids, Friction
Proceedings Papers

A Molecular Dynamics Study on the Effects of Nanostructural Clearances on Thermal Resistance at a Liquid-Solid Interface

Masahiko Shibahara, Kiyoshi Takeuchi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 293-298, August 8–13, 2010
Paper No: IHTC14-22152
DOI: https://doi.org/10.1115/IHTC14-22152
View Paper titled, A Molecular Dynamics Study on the Effects of Nanostructural Clearances on Thermal Resistance at a Liquid-Solid Interface
Click here to open pdf in another window PDF for A Molecular Dynamics Study on the Effects of Nanostructural Clearances on Thermal Resistance at a Liquid-Solid Interface
Topics: Molecular dynamics, Thermal resistance
Proceedings Papers

Characterization of Carbon Nanotube Array Based Thermal Interface Material After Bonding Process

Rong-Shiuan Chu, Yang Zhao, Arun Majumdar
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 449-455, August 8–13, 2010
Paper No: IHTC14-22989
DOI: https://doi.org/10.1115/IHTC14-22989
View Paper titled, Characterization of Carbon Nanotube Array Based Thermal Interface Material After Bonding Process
Click here to open pdf in another window PDF for Characterization of Carbon Nanotube Array Based Thermal Interface Material After Bonding Process
Topics: Bonding, Carbon nanotubes, Thermal conductivity, Contact resistance, Glass, Pressure, Adhesion, Deformation, Density, Reflectance
Proceedings Papers

Effects of Surface Roughness and Oxide Layer on the Thermal Boundary Conductance at Aluminum/Silicon Interfaces

Patrick E. Hopkins, Leslie M. Phinney, Justin R. Serrano, Thomas E. Beechem
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 313-319, August 8–13, 2010
Paper No: IHTC14-22268
DOI: https://doi.org/10.1115/IHTC14-22268
View Paper titled, Effects of Surface Roughness and Oxide Layer on the Thermal Boundary Conductance at Aluminum/Silicon Interfaces
Click here to open pdf in another window PDF for Effects of Surface Roughness and Oxide Layer on the Thermal Boundary Conductance at Aluminum/Silicon Interfaces
Topics: Aluminum, Electrical conductance, Silicon, Surface roughness, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Atomic force microscopy, Interfacial thermal resistance, Mean free path