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Electronic & Photonic Packaging
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Journal of Heat Transfer  |  research-article
2018
Bugra Sarper, Mehmet Saglam and Dr. Orhan Aydin
J. Heat Transfer , (2018);  doi:10.1115/1.4041187

Journal of Engineering for Gas Turbines and Power  |  research-article
2018
Xiao Wei, Guo Zhenyan and Chen Pimin
J. Eng. Gas Turbines Power , (2018);  doi:10.1115/1.4041079

Journal of Electronic Packaging  |  Technical Brief
2018
Bo Wu, Shuanghai Zhang, Fuliang Wang and Zhuo Chen
J. Electron. Packag 140, 044502 (2018) (5 pages);  doi:10.1115/1.4040794

Journal of Electronic Packaging  |  research-article
2018
Qiming Zhang, Jeffery Lo, Shi-Wei Ricky Lee and Wei Xu
J. Electron. Packag , (2018);  doi:10.1115/1.4041064

Journal of Electronic Packaging  |  Technical Brief
2018
Richard C. Jaeger, Jeffrey C. Suhling and Jun Chen
J. Electron. Packag 140, 044501 (2018);  doi:10.1115/1.4040829

Journal of Electronic Packaging  |  research-article
2018
Weijun Zhu, Gang Dong and Yintang Yang
J. Electron. Packag 140, 041002 (2018) (10 pages);  doi:10.1115/1.4040670

Journal of Electronic Packaging  |  research-article
2018
Hsien-Chie Cheng, Ruei-You Hong and W. H. Chen
J. Electron. Packag , (2018);  doi:10.1115/1.4041014

Journal of Electronic Packaging  |  research-article
2018
Bastian Rheingans, Roman Furrer, Juerg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens and Jolanta Janczak-Rusch
J. Electron. Packag , (2018);  doi:10.1115/1.4040978

Journal of Mechanical Design  |  research-article
2018
Umar Farooq Ghumman, Akshay Iyer, Rabindra Dulal, Joydeep Munshi, Aaron Wang, TeYu Chien, Ganesh Balasubramanian and Wei Chen
J. Mech. Des , (2018);  doi:10.1115/1.4040912

Journal of Electronic Packaging  |  research-article
2018
Hamoon Azizsoltani and Achintya Haldar
J. Electron. Packag , (2018);  doi:10.1115/1.4040924

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

ASME 2018 Verification and Validation Symposium
2018
Kevin Irick and Nima Fathi
VVS2018, pp. V001T03A002- (2018) 8 pages
doi:10.1115/VVS2018-9317

2018 Design of Medical Devices Conference
2018
David A. Nelson, Saeed I. Latif, Chad Austin and Jeremy Chatham
DMD2018, pp. V001T01A013- (2018) 4 pages
doi:10.1115/DMD2018-6912

Volume 5: Education and Globalization
2017
Michael G. Mauk, Richard Y. Chiou, Shraman Kadapa, Yalcin Ertekin and Tzu-Liang (Bill) Tseng
IMECE2017, pp. V005T06A040- (2017) 8 pages
doi:10.1115/IMECE2017-72264

Volume 7: Fluids Engineering
2017
Flávia V. Barbosa, Pedro E. A. Ribeiro, Maria F. Cerqueira, Delfim F. Soares, José C. F. Teixeira, Senhorinha F. C. F. Teixeira, Rui A. M. M. Lima and Diana M. D. Pinho
IMECE2017, pp. V007T09A035- (2017) 10 pages
doi:10.1115/IMECE2017-71413

Volume 8: Heat Transfer and Thermal Engineering
2017
Tadeh Avanessian and Gisuk Hwang
IMECE2017, pp. V008T10A074- (2017) 8 pages
doi:10.1115/IMECE2017-72663

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2017
Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi and Kenji Hirohata
IMECE2017, pp. V010T13A019- (2017) 8 pages
doi:10.1115/IMECE2017-72027

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Richard J. Manley, Dennis G. Gallagher, William W. Hughes, III and Allie M. Pilcher
IMECE2017, pp. V014T07A012- (2017) 7 pages
doi:10.1115/IMECE2017-70026

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros and José C. Teixeira
IMECE2017, pp. V014T11A020- (2017) 7 pages
doi:10.1115/IMECE2017-71532

Volume 2: Emissions Control Systems; Instrumentation, Controls, and Hybrids; Numerical Simulation; Engine Design and Mechanical Development
2017
Jian Gao, Ronald O. Grover, Jr., Venkatesh Gopalakrishnan, Ramachandra Diwakar, Wael Elwasif, K. Dean Edwards, Charles E. A. Finney and Russell Whitesides
ICEF2017, pp. V002T06A025- (2017) 7 pages
doi:10.1115/ICEF2017-3631

Volume 1: Aerospace Applications; Advances in Control Design Methods; Bio Engineering Applications; Advances in Non-Linear Control; Adaptive and Intelligent Systems Control; Advances in Wind Energy Systems; Advances in Robotics; Assistive and Rehabilitation Robotics; Biomedical and Neural Systems Modeling, Diagnostics, and Control; Bio-Mechatronics and Physical Human Robot; Advanced Driver Assistance Systems and Autonomous Vehicles; Automotive Systems
2017
Hanie O. Baayoun and Zheng Chen
DSCC2017, pp. V001T25A003- (2017) 8 pages
doi:10.1115/DSCC2017-5078

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