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Electronic & Photonic Packaging
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Journal of Biomechanical Engineering  |  Technical Brief
2018
Aoife Healy, Kimberley Linyard-Tough and Nachiappan Chockalingam
J Biomech Eng 141, 014501 (2018) (4 pages);  doi:10.1115/1.4041619
INCLUDES:  Supplemental Content

Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems  |  research-article
2018
Q. Pan and G. S. Schajer
ASME J Nondestructive Evaluation 2, 011003 (2018) (6 pages);  doi:10.1115/1.4041567

Journal of Computational and Nonlinear Dynamics  |  research-article
2018
Sergio Elaskar and Ezequiel del Río
J. Comput. Nonlinear Dynam 13, 121001 (2018) (10 pages);  doi:10.1115/1.4041577

Journal of Thermal Science and Engineering Applications  |  Technical Brief
2018
Shuo Wang, Peter Shankles, Scott Retterer, Yong Tae Kang and Chang Kyoung Choi
J. Thermal Sci. Eng. Appl 11, 014501 (2018) (3 pages);  doi:10.1115/1.4041436

Journal of Electronic Packaging  |  research-article
2018
Lei Wang, J. Wang and Fei Xiao
J. Electron. Packag , (2018);  doi:10.1115/1.4041714

Journal of Micro and Nano-Manufacturing  |  Technical Brief
2018
Jingwen Yan, Han Wang and Hong Shen
J. Micro Nano-Manuf 6, 044501 (2018) (5 pages);  doi:10.1115/1.4041509

Journal of Electronic Packaging  |  research-article
2018
Yuntao Cui, Yujie Ding, Shuo Xu, Yushu Wang, Wei Rao and Jing Liu
J. Electron. Packag , (2018);  doi:10.1115/1.4041665

Journal of Electronic Packaging  |  research-article
2018
Arman Nokhosteen, Madjid Soltani and Banafsheh Barabadi
J. Electron. Packag , (2018);  doi:10.1115/1.4041666

Journal of Electronic Packaging  |  research-article
2018
Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel and Suresh V. Garimella
J. Electron. Packag 140, 041008 (2018) (8 pages);  doi:10.1115/1.4041360

Journal of Electronic Packaging  |  Review Article
2018
Swapnil S. Salvi, Vishal Bhalla, Robert A. Taylor, Vikrant Khullar, Todd P. Otanicar, Patrick E. Phelan and Himanshu Tyagi
J. Electron. Packag 140, 040802 (2018) (21 pages);  doi:10.1115/1.4041219

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

ASME 2018 Noise Control and Acoustics Division Session presented at INTERNOISE 2018
2018
Marco Zennaro, Alex Haig, Dan J. O’Boy and Stephen J. Walsh
NCAD2018, pp. V001T08A004- (2018) 6 pages
doi:10.1115/NCAD2018-6125

Volume 1: Fuels, Combustion, and Material Handling; Combustion Turbines Combined Cycles; Boilers and Heat Recovery Steam Generators; Virtual Plant and Cyber-Physical Systems; Plant Development and Construction; Renewable Energy Systems
2018
Abdulrahman Homadi and Tony Hall
POWER2018, pp. V001T06A029- (2018) 7 pages
doi:10.1115/POWER2018-7538

ASME 2018 12th International Conference on Energy Sustainability
2018
Jiawei Gong and Sumathy Krishnan
ES2018, pp. V001T12A002- (2018) 7 pages
doi:10.1115/ES2018-7227

ASME 2018 12th International Conference on Energy Sustainability
2018
Joshua Smay, Ola Rashwan, James Then and Darien Perez
ES2018, pp. V001T12A003- (2018) 6 pages
doi:10.1115/ES2018-7533

ASME 2018 12th International Conference on Energy Sustainability
2018
Ali Radwan, Meshack Hawi and Mahmoud Ahmed
ES2018, pp. V001T12A004- (2018) 10 pages
doi:10.1115/ES2018-7569

Volume 1: Additive Manufacturing; Bio and Sustainable Manufacturing
2018
Sagil James, Rinkesh Contractor, Chris Veyna and Galen Jiang
MSEC2018, pp. V001T01A022- (2018) 8 pages
doi:10.1115/MSEC2018-6709

Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA
2018
Roby Lynn, Roberto Leo Medrano, Didier Contis, Tommy Tucker and Thomas Kurfess
MSEC2018, pp. V002T07A001- (2018) 8 pages
doi:10.1115/MSEC2018-6322

Volume 4: Processes
2018
Zewei Yuan, Kai Cheng, Yan He and Meng Zhang
MSEC2018, pp. V004T03A002- (2018) 9 pages
doi:10.1115/MSEC2018-6615

Volume 4: Processes
2018
Haojun Yang, Yan Chen and Jiuhua Xu
MSEC2018, pp. V004T03A052- (2018) 10 pages
doi:10.1115/MSEC2018-6382

Volume 2: CFD and FSI
2018
Xiang Chen and Decheng Wan
OMAE2018, pp. V002T08A023- (2018) 8 pages
doi:10.1115/OMAE2018-78369

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