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Electronic & Photonic Packaging
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Journal of Electronic Packaging  |  research-article
2018
Dylan Patrick McNally, Ryan Lewis and Y.C. Lee
J. Electron. Packag , (2018);  doi:10.1115/1.4042255

Journal of Biomechanical Engineering  |  research-article
2018
Akinjide R. Akintunde, Kathryn M. Robison, Daniel J. Capone, Laurephile Desrosiers, Leise R. Knoepp and Kristin S. Miller
J Biomech Eng 141, 021011 (2018) (11 pages);  doi:10.1115/1.4042014
INCLUDES:  Supplemental Content

Journal of Thermal Science and Engineering Applications  |  research-article
2018
Ercan M. Dede, Yanghe Liu, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan and Jong-Won Shin
J. Thermal Sci. Eng. Appl 11, 021011 (2018) (12 pages);  doi:10.1115/1.4041440

Journal of Solar Energy Engineering  |  research-article
2018
Majid Horoufiany and Reza Ghandhari
J. Sol. Energy Eng 141, 031013 (2018) (7 pages);  doi:10.1115/1.4041930

Journal of Manufacturing Science and Engineering  |  research-article
2018
Joongeok Kim, Juhee Lim, Changsu Park, Ho Myung, Jongsoo Lee and Shinill Kang
J. Manuf. Sci. Eng , (2018);  doi:10.1115/1.4042125

Journal of Manufacturing Science and Engineering  |  research-article
2018
J. Ernesto Solanes, Luis Gracia, Pau Muñoz-Benavent, Jaime Valls Miro, Carlos Perez-Vidal and Josep Tornero
J. Manuf. Sci. Eng 141, 011013 (2018) (14 pages);  doi:10.1115/1.4041836

Journal of Manufacturing Science and Engineering  |  research-article
2018
Marco Marconi, Giacomo Palmieri, Massimo Callegari and Michele Germani
J. Manuf. Sci. Eng , (2018);  doi:10.1115/1.4042006

Journal of Electronic Packaging  |  research-article
2018
Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li and Cheng Ma
J. Electron. Packag , (2018);  doi:10.1115/1.4041984

Journal of Engineering for Gas Turbines and Power  |  research-article
2018
Xiao Wei, Guo Zhengyan and Chen Pimin
J. Eng. Gas Turbines Power 141, 021034 (2018) (6 pages);  doi:10.1115/1.4041079

Journal of Electronic Packaging  |  Review Article
2018
Seungkyu Oh, James Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak and Jae-Hyun Ryou
J. Electron. Packag , (2018);  doi:10.1115/1.4041813

Proceedings of the 10th International Symposium on Cavitation (CAV2018)  |  Paper
2018
Jin Wang, Cao Zhang and Joseph Katz
Proceedings of the 10th International Symposium on Cavitation (CAV2018) GPU-Based, Parallel-Line, Omni-Directional Integration of the Acceleration Field to Obtain the 3D Pressure Distribution (2018) (4 pages);  doi:10.1115/1.861851_ch93

Proceedings of the 10th International Symposium on Cavitation (CAV2018)  |  Paper
2018
Ece Ozdemir, Berk Ozer, Gokberk Deprem, Ahmad Reza Motezakker, Luis Guillermo Villanueva, Morteza Ghorbani and Ali Koşar
Proceedings of the 10th International Symposium on Cavitation (CAV2018) Hysteresis in Cavitating Flows within Transparent Microchips (2018) (6 pages);  doi:10.1115/1.861851_ch99

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Volume 1: Advances in Control Design Methods; Advances in Nonlinear Control; Advances in Robotics; Assistive and Rehabilitation Robotics; Automotive Dynamics and Emerging Powertrain Technologies; Automotive Systems; Bio Engineering Applications; Bio-Mechatronics and Physical Human Robot Interaction; Biomedical and Neural Systems; Biomedical and Neural Systems Modeling, Diagnostics, and Healthcare
2018
Hailin Ren, Anil Kumar, Xinran Wang and Pinhas Ben-Tzvi
DSCC2018, pp. V001T07A005- (2018) 7 pages
doi:10.1115/DSCC2018-9007

Volume 2: Control and Optimization of Connected and Automated Ground Vehicles; Dynamic Systems and Control Education; Dynamics and Control of Renewable Energy Systems; Energy Harvesting; Energy Systems; Estimation and Identification; Intelligent Transportation and Vehicles; Manufacturing; Mechatronics; Modeling and Control of IC Engines and Aftertreatment Systems; Modeling and Control of IC Engines and Powertrain Systems; Modeling and Management of Power Systems
2018
Donald J. Docimo, Herschel C. Pangborn and Andrew G. Alleyne
DSCC2018, pp. V002T19A010- (2018) 10 pages
doi:10.1115/DSCC2018-9215

Volume 1: Development and Characterization of Multifunctional Materials; Modeling, Simulation, and Control of Adaptive Systems; Integrated System Design and Implementation
2018
Felix Welsch, Susanne-Marie Kirsch, Paul Motzki, Marvin Schmidt and Stefan Seelecke
SMASIS2018, pp. V001T04A014- (2018) 5 pages
doi:10.1115/SMASIS2018-7980

ASME-JSME 2018 Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment
2018
Toshifumi Ohkubo, Nobuyuki Terada and Yoshikazu Yoshida
ISPS-MIPE2018, pp. V001T05A001- (2018) 3 pages
doi:10.1115/ISPS-MIPE2018-8503

ASME-JSME 2018 Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment
2018
No-Cheol Park, Sungbin Jeon, Jae-Yong Lee, Se-Hwan Jang, Jang-Hyun Cho, Jin-Sang Lim, Young-Joo Kim and Young-Pil Park
ISPS-MIPE2018, pp. V001T10A002- (2018) 3 pages
doi:10.1115/ISPS-MIPE2018-8518

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2018
Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang and Xiaobing Luo
InterPACK2018, pp. V001T01A001- (2018) 5 pages
doi:10.1115/IPACK2018-8211

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2018
Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou and Ming Xiang Chen
InterPACK2018, pp. V001T01A003- (2018) 6 pages
doi:10.1115/IPACK2018-8226

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2018
Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong and Seungbae Park
InterPACK2018, pp. V001T01A004- (2018) 7 pages
doi:10.1115/IPACK2018-8257

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2018
Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang and Xiaobing Luo
InterPACK2018, pp. V001T01A006- (2018) 6 pages
doi:10.1115/IPACK2018-8301

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2018
Piyas Chowdhury, Kamal Sikka, Anuja De Silva and Indira Seshadri
InterPACK2018, pp. V001T01A007- (2018) 12 pages
doi:10.1115/IPACK2018-8337

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